Die Bonder
Model Lineup
KE-100 series
KE-100 series is a low-cost LED die bonder most appropriate for development and mass production trial. Compatible with a variety of work by changing its bonding stage.
- Applications: Mainly LED manufacturing
| Bonding speed | 0.64 seconds / cycle |
|---|---|
| Bonding accuracy | XY: ±50 μm θ: ±5 ° |
| Bonding area | MAX: 300×100 |
KE-200 series
KE-200 series is a LED die bonder implementing at high speed and with high accuracy. Compatible with a wide variety of work by changing its bonding stage.
- Applications: Mainly LED manufacturing
| Bonding speed | 0.4 seconds / cycle |
|---|---|
| Bonding accuracy | XY: ±50 μm θ: ±5 ° |
| Bonding area | MAX: 300×60 |
KE-400 series
KE-400 series is a high accuracy and high speed LED die bonder provided with linear-driven high speed bonding and high solution image processing functions.
- Applications: Mainly LED manufacturing
| Bonding speed | 0.2 seconds / cycle |
|---|---|
| Bonding accuracy | XY: ±30 μm θ: ±3 ° |
| Bonding area | MAX: 200×100 |
LD manufacturing equipment
【KFA-11】
LD manufacturing equipment common to LD chip and PD chip.
【PD die bonder】
High-accuracy die bonder to mount PD chips.
- Applications: LD manufacturing