We have a lineup of various die bonders.

Kosaka Laboratory Ltd.

Die Bonder

Model Lineup

KE-100 series

Die Bonder / KE-100 series

KE-100 series is a low-cost LED die bonder most appropriate for development and mass production trial. Compatible with a variety of work by changing its bonding stage.

  • Applications: Mainly LED manufacturing
Bonding speed 0.64 seconds / cycle
Bonding accuracy XY: ±50 μm  θ: ±5 °
Bonding area MAX: 300×100
KE-200 series

Die Bonder / KE-200 series

KE-200 series is a LED die bonder implementing at high speed and with high accuracy. Compatible with a wide variety of work by changing its bonding stage.

  • Applications: Mainly LED manufacturing
Bonding speed 0.4 seconds / cycle
Bonding accuracy XY: ±50 μm  θ: ±5 °
Bonding area MAX: 300×60
KE-400 series

Die Bonder / KE-400 series

KE-400 series is a high accuracy and high speed LED die bonder provided with linear-driven high speed bonding and high solution image processing functions.

  • Applications: Mainly LED manufacturing
Bonding speed 0.2 seconds / cycle
Bonding accuracy XY: ±30 μm  θ: ±3 °
Bonding area MAX: 200×100
LD manufacturing equipment

Die Bonder / LD manufacturing equipment(KFA-11, PD die bonder)

【KFA-11】
LD manufacturing equipment common to LD chip and PD chip.

【PD die bonder】
High-accuracy die bonder to mount PD chips.

  • Applications: LD manufacturing